How Advanced Foams and Films Are Changing Electronics Enclosures
Overview Summary Advanced foams and films are helping electronics manufacturers reduce enclosure weight and thickness without sacrificing performance. New EMI/RFI shielding materials are improving protection against signal interference in compact electronic assemblies. Conductive foams, metalized films, graphite materials, and hybrid laminates are enabling more flexible enclosure designs. Engineers are using thinner substrates to support smaller … Continued










